產(chǎn)品詳情
| 中文名稱:硅膠墊片 | 英文名稱:BERGQUIST GP3000S30 GAP PAD TGP 3000 GAP PAD 3000S30 |
| 品牌: BERGQUIST | 產(chǎn)地: USA |
| 產(chǎn)品類別: GAP PAD |
| 型號: BERGQUIST GP3000S30 GAP PAD TGP 3000 GAP PAD 3000S30 | 外形尺寸: 203*406MM |
2023-07-02
硅膠墊片
BERGQUIST GP3000S30 GAP PAD TGP 3000 GAP PAD 3000S30
1SHEET/1RMB
1
BERGQUIST
USA
GAP PAD
features and Benefits
? Thermal conductivity: 3.0 W/m-K
? Low “S-Class” thermal resistance at very
low pressures
? Highly conformable,“S-Class” softness
? Designed for low-stress applications
? Fiberglass reinforced for puncture, shear
and tear resistance
BERGQUIST GP3000S30 is a soft gap filling material
rated at a thermal conductivity of 3 W/m-K.
The material offers exceptional thermal
performance at low pressures due to an allnew
3 W/m-K filler package and low-modulus
resin formulation. It is reinforced to enhance
material handling, puncture, shear and tear
resistance. It is well suited for high performance,
low-stress applications that typically use
fixed standoff or clip mounting. Gap Pad
3000S30 maintains a conformable yet elastic
nature that allows for excellent interfacing
and wet-out characteristics, even to surfaces
with high roughness and/or topography.
GAP PAD TGP 3000 (thermal pad) is offered with natural
inherent tack on both sides of the material,
eliminating the need for thermally-impeding
adhesive layers.The material’s natural inherent
tack allows for stick-in-place characteristics
during assembly. GAP PAD 3000S30(BERGQUIST thermal pad)is supplied
with protective liners on both sides.The top
side has reduced tack for ease of handling.
關(guān)鍵字： BERGQUIST GP3000S30;GAP PAD TGP 3000;GAP PAD 3000S30;
公司簡介
Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems.
The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment.
Company culture, Integrity and pragmatism, quick response, keep improving.
| 成立日期 |
2013-03-23
（12年）
|
注冊資本 |
300萬人民幣
|
| 員工人數(shù) |
1-10人 |
年營業(yè)額 |
￥ 1000萬-5000萬 |
| 主營行業(yè) |
聚合物材料,特種纖維及高功能材料,工業(yè)膠水 |
經(jīng)營模式 |
貿(mào)易 |