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導熱硅膠墊片,BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
  • 導熱硅膠墊片,BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
  • 導熱硅膠墊片,BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000

BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000

價格 詢價
包裝 5sheet
最小起訂量 1000sheet
發(fā)貨地 廣東
更新日期 2023-06-28

產(chǎn)品詳情

中文名稱:導熱硅膠墊片英文名稱:BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000
品牌: BERGQUIST產(chǎn)地: US
產(chǎn)品類別: GAP PAD
型號: GPHC5.0外形尺寸: 203*406MM
2023-06-28 導熱硅膠墊片 BERGQUIST GPHC5.0 GAP PAD HC5.0 GAP PAD TGP HC5000 5sheet/1RMB 1 BERGQUIST US GAP PAD

    Features and Benefits

    ? Thermal conductivity: 5.0 W/m-K 

    ? High-compliance, low compression stress 

    ? Fiberglass reinforced for shear and  tear resistance

BERGQUIST GAP PAD TGP HC5000 (Thermal Conductivity Silicone Sheet)is  a soft and compliant gap filling material  with 

a thermal conductivity of 5.0 W/m-K.  The material offers exceptional thermal  performance 

at low pressures due to a  unique filler package and low-modulus resin  formulation. 

The enhanced material is ideal  for applications requiring low stress on  components 

and boards during assembly.  BERGQUIST GPHC5.0(Thermal Conductive Insulating Silicone Gasket) maintains a conformable 

nature that  allows for excellent interfacing and wet-out  characteristics, even to surfaces with 

high  roughness and/or topography. BERGQUIST GAP PAD HC5.0 (Thermal Silicone Pad)is  offered with 

natural inherent tack on both  sides of the material, eliminating the need  for thermally-impeding 

adhesive layers.  The top side has minimal tack for ease of  handling. BERGQUIST GAP PAD TGP  HC5000 

is supplied with protective liners on both sides.


關鍵字: BERGQUIST GPHC5.0;GAP PAD HC5.0;GAP PAD TGP HC5000;

公司簡介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.
成立日期 2013-03-23 (12年) 注冊資本 300萬人民幣
員工人數(shù) 1-10人 年營業(yè)額 ¥ 1000萬-5000萬
主營行業(yè) 聚合物材料,特種纖維及高功能材料,工業(yè)膠水 經(jīng)營模式 貿(mào)易
  • 深圳市華思瑞科技有限公司
非會員
  • 公司成立:12年
  • 注冊資本:300萬人民幣
  • 企業(yè)類型:有限責任公司
  • 主營產(chǎn)品:美國BERGQUIST、日本DENKA等導熱絕緣材料
  • 公司地址:Building F3, Jinyucheng Park, Longgang District
詢盤

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