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導(dǎo)熱矽膠布,BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S
  • 導(dǎo)熱矽膠布,BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S
  • 導(dǎo)熱矽膠布,BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S

BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S

價(jià)格 詢價(jià)
包裝 1ROLL
最小起訂量 1000ROLL
發(fā)貨地 廣東
更新日期 2023-06-30

產(chǎn)品詳情

中文名稱:導(dǎo)熱矽膠布英文名稱:BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S
品牌: BERGQUIST產(chǎn)地: USA
產(chǎn)品類別: SIL PAD
型號(hào): SP900S外形尺寸: 304.8MM*76.2M
2023-06-30 導(dǎo)熱矽膠布 BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S 1ROLL/1RMB 1 BERGQUIST USA SIL PAD


    BERGQUIST SP900S Features and Benefits:

    ? Thermal impedance: :0.61°C-in2/W(@50 psi)

    ? Electrically isolating

    ? Low mounting pressures

    ? Smooth and highly compliant surface

    ? General-purpose thermal interface material solution


BERGQUIST SP900S, SIL PAD 900S,  SIL PAD TSP 1600S  

The true workhorse of the SIL PAD  product family, SIL PAD900S (SP900S)thermally  conductive insulation material 

is designed for a wide variety of applications  requiring high thermal performance and electrical isolation. 

These applications  also typically have low mounting  pressures for component?clamping.

SIL PAD 900S (SIL PAD TSP 1600S)material combines a smooth and highly compliant surface  characteristic with 

high thermalconductivity. These features optimize the thermal resistance properties at  low pressures.

Applications requiring low component  clamping forces include discrete semiconductors (TO-220, TO-247

 and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount 

of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal

 resistance and  maximizes thermal performance.


Typical Applications Include:

? Power supplies

? Automotive electronics

? Motor controls

? Power semiconductors

Configurations Available:

? Sheet form, die-cut parts and roll form

? With or without pressure sensitive adhesive


關(guān)鍵字: BERGQUIST SP900S;SIL PAD TSP 1600S;SIL PAD 900S;

公司簡介

Shenzhen Hothree Technology Co., Ltd. was established in 2011. It is a technology-oriented company that is oriented to customer needs and is committed to providing customers with professional solutions for thermal conduction and EMI electromagnetic compatibility problems. The company mainly distributes thermal interface materials and shielding (EMI) materials for well-known brands such as Bergquist ,LAIRD in the US and Denka in Japan. At the same time, the company is also developing and integrating new high-performance products to meet system designers' requirements for thermal conductivity. Products are widely used in 5G communications, optical modules, security electronics, automotive electronics, outdoor base stations, lithium batteries, mobile phones, computers, LED, instruments, aerospace and medical equipment. Company culture, Integrity and pragmatism, quick response, keep improving.
成立日期 2013-03-23 (12年) 注冊(cè)資本 300萬人民幣
員工人數(shù) 1-10人 年?duì)I業(yè)額 ¥ 1000萬-5000萬
主營行業(yè) 聚合物材料,特種纖維及高功能材料,工業(yè)膠水 經(jīng)營模式 貿(mào)易
  • 深圳市華思瑞科技有限公司
非會(huì)員
  • 公司成立:12年
  • 注冊(cè)資本:300萬人民幣
  • 企業(yè)類型:有限責(zé)任公司
  • 主營產(chǎn)品:美國BERGQUIST、日本DENKA等導(dǎo)熱絕緣材料
  • 公司地址:Building F3, Jinyucheng Park, Longgang District
詢盤

BERGQUIST SP900S SIL PAD TSP 1600S SIL PAD 900S相關(guān)廠家報(bào)價(jià)

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詢價(jià)
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VIP4年
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VIP1年
武漢吉業(yè)升化工有限公司
2024-12-30
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